Doodlebug Design Inc Weblog: HEY PUMPKIN ACCORDION MINI ALBUM


Hey everybody, It is Conny! I am excited to share a gorgeous accordion mini album showcasing the gorgeous Hey Pumpkin Assortment. This album was a pleasure to create, providing the proper canvas for including images on either side. I particularly loved the chance to design flip-up pages, including an additional ingredient of shock and creativity to the album.

Let’s get began! I began with two chipboard items measuring 4 1/2″ x 6 1/2″. I used black cardstock measuring 8″ x 6 1/8″ to cowl them.  I positioned the chipboard within the center utilizing a guide cowl information, leaving about 3/4″ throughout and added adhesive throughout the three/4″ and folded these into the chipboard.

Subsequent, I created the accordion pages. I used 110 lb black cardstock for the pages, measuring 6 1/2″ x 11″,  scored at 4 1/2″ x 9″. The ends that measure 2″ between the 9″ x11″ had been adhered to the chipboard covers. After including the hinges to the chipboard,  I joined the pages, making a zigzag! If you wish to create a pocket out of the pages you might be becoming a member of, that can be an choice. Ensure when matting the pages, the pocket is dealing with up. The black cardstock papers all through the album measure 4 3/8″ x 6 3/8″. Subsequent I selected my favourite papers from the gathering.

The white photograph matts had been minimize in three sizes: 3 3/4″ x 4 1/4″, 6″ x 3 3/4″, and eight 1/2″ x 4 3/4″.  I scored the longest facet of the 8 1/2″ x 4 3/4″ mat at 4 1/4″ to create flip-up pages.  I embellished them with my favourite items from the Bits and Items, Odds & Ends, chit chat, and extra.

You could find the method video on my YouTube channel (hyperlink under)  Thanks for stopping by, and I am unable to wait to see what you create utilizing the Hey Pumpkin Assortment. Completely happy Haunting!!! Xo Conny!!  

DOODLEBUG PRODUCTS USED


Hey Pumpkin Assortment
BlackCardstok

Foam Adhesive
Chipboard
Seam Tape

Leave a Reply

Your email address will not be published. Required fields are marked *